Dual-pattern optical 3d dimensioning

ABSTRACT

An optical dimensioning system includes one or more light emitting assemblies configured to project a predetermined pattern on an object; an imaging assembly configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected; and a processing assembly configured to analyze the image of the object to determine one or more dimension parameters of the object. A method for optical dimensioning includes illuminating an object with at least two identical patterns; capturing at least one image of the illuminated object; and calculating dimensions of the object by analyzing pattern separation of the elements comprising the projected patterns. The patterns can be produced by one or more pattern generators.

FIELD OF THE INVENTION

The present invention relates to optical dimensioning, and more particularly to dual-pattern optical 3D dimensioning.

BACKGROUND

Generally speaking, optical 3D dimensioning with structural light triangulation imaging (parallax) suffers accuracy loss introduced by variations in relative positions and orientations of a projector, camera, and projector-camera pair. These variations can result from thermal, structural, or other changes, such as component aging. The dimensioning accuracy problem can be partially solved with calibration, but the ultimate accuracy is still limited due to the non-calibratable part of variations, such as shock and vibration. In addition, temperature change of the system due to the ambient temperature change or self-generated heat may affect the triangular geometry. Temperature gradient change occurring due to the nonuniform heat-generating source and heat dissipation may introduce complex deformations to the triangular system geometry and individual components, and is hard to resolve by calibration. More specifically, changes in camera focusing and distortion may directly contribute to the 3D dimensioning error. Additionally, such changes are difficult to control or correct with calibration. Components of a camera module are usually made from multiple materials with significantly different thermal expansion coefficients (CTEs). For example, the materials may include silicon sensor with 3.5 ppm/C, glass lens ˜9 ppm/C, aluminum barrel and holder 22 ppm/C, plastic parts >60 ppm/C. Such a combination makes it virtually impossible to fully compensate for the changes in pattern image positions on the image sensor introduced by the thermal expansion.

To overcome this issue, instead of the standard projector-camera pair triangulation, a dual-pattern optical 3D dimensioning system utilizing two or more identical projecting patterns may be applied to generate 3D depth data from dual-pattern image captured by the camera.

Several attempts have been made to address this issue. For example, in PCT Pat. App. No. WO 2014,011,182 by Gharib, convergence/divergence based depth determination techniques and uses with defocusing imaging are described. The system includes two projectors emitting converging red and blue light patterns, respectively (or alternatively, a single split beam), and a camera to capture the patterns. In Chinese Pat. App. No. CN 104,050,656, an apparatus and techniques for determining object depth in images are described. The system includes an emitter to project a low-resolution optical pattern and a high-resolution optical pattern, and a sensor to detect a composite image, which is then processed to obtain the depth information of the object in a range of different depths. However, none of these references mention projecting parallel light patterns, and determining the distance between neighboring points of the dual pattern for calculating the depth of the object. A paper “Development of Real Time 3-D Measurement System Using Intensity Ratio Method” by Miyasaka et al. describes a system for calculating depth of an object using intensity ratio method. The system includes a light source and video camera, wherein two types of light patterns, flat pattern and linear pattern, are projected alternatively onto the target object. Although the reference mentions calculating ratio of intensities of two different light patterns at a given pixel, it does not mention calculating ratio of distance between neighboring points, to determine the depth of the object. Furthermore, the reference does not mention using two light sources projecting dual parallel light patterns onto the target object. In US. Pat. App. No. 20,160,288,330 by Konolige, a system and method for depth sensing are described. The system includes a light source, a computing device, and two optical sensors separated by a fixed distance, each having a first set of multiple photodetectors to capture visible light, and a second set of multiple photodetectors to capture infrared light. The depth information obtained from both the visible and infrared light images is combined to determine a depth map of surfaces or objects. However, the reference does not mention using two projectors producing parallel light patterns simultaneously onto the target. Furthermore, the reference does not mention determining the distance between the neighboring light patterns and using it for calculating the depth of the target.

Therefore, a need exists for a system and method of accurate optical dimensioning.

SUMMARY

Accordingly, in one aspect, the present invention embraces an assembly and system for optical dimensioning.

In an exemplary embodiment, a dimensioning assembly includes a camera module; a first pattern generator, disposed near the camera module; a second pattern generator, disposed near the camera module and spaced apart from the first pattern generator, wherein the first and the second pattern projection assemblies are configured to generate identical patterns; and a processing system configured to detect and analyze positions of elements of the generated patterns.

In another exemplary embodiment, an optical dimensioning system includes one or more light emitting assemblies configured to project a predetermined pattern on an object; an imaging assembly configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected; and a processing assembly configured to analyze the image of the object to determine dimension parameters of the object.

In another aspect, the present invention embraces a method for optical dimensioning. The method includes illuminating an object with at least two identical patterns; capturing an image of the illuminated object; and calculating dimensions of the object by analyzing pattern separation of the elements comprising the projected patterns.

The foregoing illustrative summary, as well as other exemplary objectives and/or advantages of the invention, and the manner in which the same are accomplished, are further explained within the following detailed description and its accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A schematically depicts a dimensioning assembly, according to an embodiment.

FIG. 1B schematically depicts a dual pattern produced by the dimensioning assembly, according to an embodiment.

FIGS. 2A-2D schematically depict relative positions of a camera module and pattern generators within a dimensioning assembly, according to embodiments.

FIG. 3A schematically depicts an optical dimensioning system, according to an embodiment.

FIG. 3B schematically depicts an optical dimensioning system with a relay lens, according to an embodiment.

FIG. 4 schematically depicts a method for dual-pattern optical dimensioning, according to an embodiment.

DETAILED DESCRIPTION

The present invention embraces an assembly, system, and method for optical dimensioning.

Generally speaking, dual-pattern measurement allows extracting information based on a ratio of the image separation of the same point from two or more patterns to the image distance between adjacent points from the same pattern. Such an approach may offer various benefits compared to the traditional methods. For example, camera can be at any location or orientation, and any variation in the relative position of the camera will not affect the result of the measurements. Additionally, identical patterns with a predetermined separation can be generated from two identical projectors, or a single projector with a beam splitter. Two identical projecting assemblies can exhibit identical or almost identical variations, which will not introduce positioning error. Results obtained with the single projector with a beam splitter can be free from minor pattern pair difference contributions. Moreover, a dual-pattern image with known pattern separation can produce a 3D dimensioning result regardless of changes in camera focusing, distortion and magnification. Change in image position on the sensor introduced by thermal expansion may not affect the outcome, as the result is the ratio of pattern image separation to the pattern image base feature.

Potential applications of 3D optical dimensioning system include but are not limited to: object dimensioning to measure the length, width, height, volume, and irregularity, such as potential package damage in a shipment; zero contrast (surface profile only) direct product marking (DPM) barcode reading, including sensing with a mobile 3D sensor; 3D contour mapping for image recognition; and motion and gesture sensing for non-contact user interface, e.g. in electronic equipment.

FIG. 1A shows a dimensioning assembly 100, according to an embodiment. The assembly 100 includes a camera module 102 having one or more image sensors and an imaging lens assembly. A first pattern generator 104 is disposed near the camera module 102, and has a first laser diode 106 (not shown) and a first pattern projection assembly 108 (not shown). A second pattern generator 110 is disposed near the camera module 102 and is spaced apart from the first pattern generator 104, and has a second laser diode 112 (not shown) and a second pattern projection assembly 114 (not shown). The first and the second pattern projection assemblies 108 and 114, respectively, are configured to generate identical patterns. A processing system 116 is configured to detect and analyze positions of elements of the generated patterns.

In an embodiment, the first and second pattern generators 104 and 110, respectively, can be equidistant from the camera module. Additionally, the first and/or second laser diode 106 and 112, respectively, can comprise a vertical-cavity surface-emitting laser. Alternatively, the first and/or second laser diode 106 and 112, respectively, can comprise an edge-emitting laser. Additionally, the first and/or second pattern projection assembly 108 and 114, respectively, can include a projection lens and a pattern die and/or a collimating lens and a diffractive optical element. The processing system 116 can be configured to detect and analyze positions of equivalent elements of the generated patterns. Additionally or alternatively, the processing system 116 can be configured to detect and analyze positions of adjacent elements of at least one of the patterns. The assembly 100 can further include one or more additional pattern generators disposed near the camera module 102.

FIG. 1B shows an exemplary embodiment of a dual pattern 122 produced by the dimensioning assembly 100. Depth can be calculated based on the image separation of the same point from two identical patterns. Specifically,

Depth=f(s/t),

where s is image separation of the same point from two patterns, and t is image distance between adjacent points of the same pattern (as shown in FIG. 1B).

FIGS. 2A-2D schematically depict relative positions of a camera module 202 and pattern generators 204 within a dimensioning assembly, according to several embodiments. In some embodiments, the camera module 202 and two or more pattern generators 204 can be located on the same plane, whereas in other embodiments, the camera module 202 and pattern generators 204 can be located on different planes. For example, the camera module 202 can be located on one plane, and the pattern generators 204 can be located on a different plane, which can be in front of the camera module 202 (FIG. 2B), behind the camera module 202 (FIG. 2C), or a combination of those (FIG. 2A). Alternatively, the camera module 202 can be located on one plane and the pattern generators 204 can be located on one or more arcs, which can similarly be in front of the camera module 202, behind it, or both (FIG. 2D). Only two pattern generators 204 are shown in FIGS. 2A-2D for illustrative purposes; some embodiments can include a different number of pattern generators 204. The FIGS. 2A-2D show relative positions of the camera module 202 and the patter generators 204 from the perspective of looking down from a top onto the dimensioning assembly, with the patterns being projected toward a bottom of the drawings; the horizontal lines represent mounting surfaces. Although the figures show offsetting the pattern generators 204 from the camera module 202 in the Y direction, in some embodiments they can instead, or additionally, be offset in the X and/or Z directions. Mixed configurations where the pattern generators 204 are offset in non-symmetrical ways are also possible.

FIGS. 3A and 3B show exemplary embodiments of an optical dimensioning system 300. According to an embodiment, the system 300 includes one or more light emitting assemblies 302 configured to project a predetermined pattern on an object. An imaging assembly 304 (not shown) is configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected. A processing assembly 306 (not shown) is configured to analyze the image of the object to determine one or more dimension parameters of the object.

In an embodiment, the imaging assembly 304 can include one or more image sensors with an imaging lens and/or a first beam splitter 308 adapted for multi-imaging sensing, and one or more spectral filters. The one or more light emitting assemblies 302 can include a pattern generator and a second beam splitter adapted for pattern projection. Additionally, the beam splitter can include a relay lens 310 (shown in FIG. 3B). Such a configuration may be used to reduce the size of the system, and can be especially beneficial for application with space limitation, such as mobile devices.

In an embodiment, the one or more dimension parameters of the object include a length, width, and/or height of the object. The system 300 can be configured for scanning a zero contrast direct product marking barcode, image recognition with 3D contour mapping, and/or motion and/or gesture sensing for non-contact user interface.

FIG. 4 shows a method 400 for dual-pattern optical dimensioning, according to an embodiment. At 402, an object is illuminated with at least two identical predetermined patterns projected by one or more pattern generators. At 404, at least one image of the illuminated object is captured with a camera assembly. At 406, dimensions of the object are calculated by analyzing pattern separation of the elements comprising the projected patterns.

In an embodiment, the predetermined pattern can include a point grid. The method 400 can include controlling one or more pattern separation parameters. Additionally, illuminating an object at 402 can include illuminating an object with a projector operably coupled to a beam splitter.

Device and method components are meant to show only those specific details that are pertinent to understanding the embodiments of the present disclosure so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein. In various embodiments, the sequence in which the elements of appear in exemplary embodiments disclosed herein may vary. Two or more method steps may be performed simultaneously or in a different order than the sequence in which the elements appear in the exemplary embodiments.

To supplement the present disclosure, this application incorporates entirely by reference the following commonly assigned patents, patent application publications, and patent applications:

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In the specification and/or figures, typical embodiments of the invention have been disclosed. The present invention is not limited to such exemplary embodiments. The use of the term “and/or” includes any and all combinations of one or more of the associated listed items. The figures are schematic representations and so are not necessarily drawn to scale. Unless otherwise noted, specific terms have been used in a generic and descriptive sense and not for purposes of limitation. 

1. A dimensioning assembly, comprising: a camera module having one or more image sensors and an imaging lens assembly; a first pattern generator, disposed near the camera module, and having a first laser diode and a first pattern projection assembly; a second pattern generator, disposed near the camera module and spaced apart from the first pattern generator, and having a second laser diode and a second pattern projection assembly, wherein the first and the second pattern projection assemblies are configured to generate identical patterns; and a processing system configured to detect and analyze positions of elements of the generated patterns.
 2. The assembly according to claim 1, wherein the first and second pattern generators are equidistant from the camera module.
 3. The assembly according to claim 1, wherein the first and/or second laser diode comprises a vertical-cavity surface-emitting laser.
 4. The assembly according to claim 1, wherein the first and/or second laser diode comprises an edge-emitting laser.
 5. The assembly according to claim 1, wherein the first and/or second pattern projection assembly includes a projection lens and a pattern die and/or a collimating lens and a diffractive optical element.
 6. The assembly according to claim 1, wherein the processing system is configured to detect and analyze positions of equivalent elements of the generated patterns.
 7. The assembly according to claim 1, wherein the processing system is configured to detect and analyze positions of adjacent elements of at least one of the patterns.
 8. The assembly according to claim 1, further including one or more additional pattern generators disposed near the camera module.
 9. An optical dimensioning system, comprising: one or more light emitting assemblies configured to project a predetermined pattern on an object; an imaging assembly configured to sense light scattered and/or reflected of the object, and to capture an image of the object while the pattern is projected; and a processing assembly configured to analyze the image of the object to determine one or more dimension parameters of the object.
 10. The system according to claim 9, wherein the imaging assembly includes one or more image sensors with an imaging lens and/or a first beam splitter adapted for multi-imaging sensing, and one or more spectral filters.
 11. The system according to claim 9, wherein the one or more light emitting assemblies include a pattern generator and a second beam splitter adapted for pattern projection.
 12. The system according to claim 11, wherein the beam splitter includes a relay lens.
 13. The system according to claim 9, wherein the one or more dimension parameters of the object include a length, width, and/or height of the object.
 14. The system according to claim 9, further configured for scanning a zero contrast direct product marking barcode.
 15. The system according to claim 9, further configured for image recognition with 3D contour mapping.
 16. The system according to claim 9, further configured for motion and/or gesture sensing for non-contact user interface.
 17. A method for dual-pattern optical dimensioning, comprising: illuminating an object with at least two identical predetermined patterns projected by one or more pattern generators; capturing at least one image of the illuminated object with a camera assembly; and calculating dimensions of the object by analyzing pattern separation of the elements comprising the projected patterns.
 18. The method according to claim 17, wherein the predetermined pattern includes a point grid.
 19. The method according to claim 17, further including controlling one or more pattern separation parameters.
 20. The method according to claim 17, wherein illuminating an object includes illuminating an object with a projector operably coupled to a beam splitter. 